Printed Circuit Board are the cornerstone of electronic products, it is very important for your products can run stably for a long time or not. As a professional PCB and PCB Assembly manufacturer, PCBFuture put a high value on the quality of circuit boards.
PCBFuture start from PCB Fabrication business, then extend to PCB assembly and components sourcing services, now has become one of the best turnkey PCB assembly manufacturer. We make a lot of efforts to invest on advanced equipments for better technology, optimized internal system for better efficiency, empower labors for better skills.
| Process | Item | Process Capability | |
| Base Information | Production Capability | Layer count | 1-30 layers |
| Bow and twist | 0.75% standard, 0.5% advanced | ||
| Min. finished PCB size | 10 x 10mm(0.4 x 0.4") | ||
| Max. finished PCB size | 530 x 1000mm(20.9 x 47.24 ") | ||
| Multi-press for blind/buried vias | Multi-press Cycle≤3 times | ||
| Finished board thickness | 0.3 ~ 7.0mm(8 ~ 276mil) | ||
| Finished board thickness tolerance | +/-10% standard, +/-0.1mm advanced | ||
| Surface finish | HASL, Lead free HASL, Flash gold, ENIG, Hard gold plating, OSP, Immersion Tin, Immersion silver, etc | ||
| Selective surface finish | ENIG+Gold finger, Flash gold+Gold finger | ||
| Material Type | FR4, Aluminum, CEM, Rogers, PTFE, Nelco, Polyimide/Polyester, etc. | Also can buy the materials as request | |
| Copper foil | 1/3oz ~ 10oz | ||
| Prepreg Type | FR4 Prepreg, LD-1080(HDI) | 106, 1080, 2116, 7628, etc.. | |
| Reliable Test | Peel strength | 7.8N/cm | |
| Fammability | 94V-0 | ||
| Ionic contamination | ≤1ug/cm² | ||
| Min. dielectric thickness | 0.075mm(3mil) | ||
| Impedance tolerance | +/-10%, min can control +/- 7% | ||
| Inner layer&Outer layer Image Transfer | Machine Capability | Scrubbing Machine | Material thickness: 0.11 ~ 3.2mm(4.33mil ~ 126mil) |
| Material size: min. 228 x 228mm(9 x 9") | |||
| Laminator, Exposer | Material thickness: 0.11 ~ 6.0mm(4.33 ~ 236mil) | ||
| Material size: min 203 x 203mm(8 x 8"), max. 609.6 x 1200mm(24 x 30 ") | |||
| Etching Line | Material thickness: 0.11 ~ 6.0mm(4.33mil ~ 236mil) | ||
| Material size: min. 177 x 177mm(7 x 7") | |||
| Inner layer Process Capability | Min. inner line width/spacing | 0.075/0.075mm(3/3mil) | |
| Min. spacing from hole edge to conductive | 0.2mm(8mil) | ||
| Min. inner layer annular ring | 0.1mm(4mil) | ||
| Min. inner layer isolation clearance | 0.25mm(10mil) standard, 0.2mm(8mil) advanced | ||
| Min. spacing from board edge to conductive | 0.2mm(8mil) | ||
| Min. gap width between copper ground | 0.127mm(5mil) | ||
| Unbalance copper thickness for inner core | H/1oz, 1/2oz | ||
| Max. finished copper thickness | 10oz | ||
| Outer layer Process Capability | Min. outer line width/spacing | 0.075/0.075mm(3/3mil) | |
| Min. hole pad size | 0.3mm(12mil) | ||
| Process Capability | Max. slot tenting size | 5 x 3mm(196.8 x 118mil) | |
| Max. tenting hole size | 4.5mm(177.2mil) | ||
| Min. tenting land width | 0.2mm(8mil) | ||
| Min. annular ring | 0.1mm(4mil) | ||
| Min. BGA pitch | 0.5mm(20mil) | ||
| AOI | Machine Capability | Orbotech SK-75 AOI | Material thickness: 0.05 ~ 6.0mm(2 ~ 236.2mil) |
| Material size: max. 597 ~ 597mm(23.5 x 23.5") | |||
| Orbotech Ves Machine | Material thickness: 0.05 ~ 6.0mm(2 ~ 236.2mil) | ||
| Material size: max. 597 ~ 597mm(23.5 x 23.5") | |||
| Drilling | Machine Capability | MT-CNC2600 Drill machine | Material thickness: 0.11 ~ 6.0mm(4.33 ~ 236mil) |
| Material size: max. 470 ~ 660mm(18.5 x 26") | |||
| Min. drill size: 0.2mm(8mil) | |||
| Process Capability | Min. multi-hit drill bit size | 0.55mm(21.6mil) | |
| Max. aspect ratio(finished board size VS Drill size) | 12:01 | ||
| Hole location tolerance(compared with CAD) | +/-3mil | ||
| Counterbore hole | PTH&NPTH, Top angle 130°,Top diameter <6.3mm | ||
| Min. spacing from hole edge to conductive | 0.2mm(8mil) | ||
| Max. drill bit size | 6.5mm(256mil) | ||
| Min. multi-hit slot size | 0.45mm(17.7mil) | ||
| Hole size tolerance for press fit | +/-0.05mm(+/-2mil) | ||
| Min. PTH slot size tolerance | +/-0.15mm(+/-6mil) | ||
| Min. NPTH slot size tolerance | +/-2mm(+/-78.7mil) | ||
| Min. spacing from hole edge to conductive(Blind vias) | 0.23mm(9mil) | ||
| Min. laser drill size | 0.1mm(+/-4mil) | ||
| Countersink hole angle&Diameter | Top 82,90,120° | ||
| Wet Process | Machine Capability | Panel&Pattern plating line | Material thickness: 0.2 ~ 7.0mm(8 ~276mil) |
| Material size: max. 610 x 762mm(24 x 30") | |||
| Deburring Maching | Material thickness: 0.2 ~ 7.0mm(8 ~276mil) | ||
| Material size: min. 203 x 203mm(8" x 8") | |||
| Desmear Line | Material thickness: 0.2mm ~ 7.0mm(8 ~276mil) | ||
| Material size: max. 610 x 762mm(24 x 30") | |||
| Tin plating line | Material thickness: 0.2 ~ 3.2mm(8 ~126mil) | ||
| Material size: max. 610 x 762mm(24 x 30") | |||
| Process Capability | Hole wall copper thickness | average 25um(1mil) standard | |
| Finished copper thickness | ≥18um(0.7mil) | ||
| Min line width for etching marking | 0.2mm(8mil)) | ||
| Max.finished copper weight for inner&outer layers | 7oz | ||
| Different copper thickness | H/1oz,1/2oz | ||
| Solder Mask& Silkscreen | Machine Capability | Scrubbing Machine | Material thickness: 0.5 ~ 7.0mm(20 ~ 276mil) |
| Material size: min. 228 x 228mm(9 x 9") | |||
| Exposer | Material thickness: 0.11 ~ 7.0mm(4.3 ~ 276mil) | ||
| Material size: max. 635 x 813mm(25 x 32") | |||
| Develop machine | Material thickness: 0.11 ~ 7.0mm(4.3 ~ 276mil) | ||
| Material size: min. 101 x 127mm(4 x 5") | |||
| Color | Solder mask color | Green, matte green, yellow, black, blue, red, white | |
| Silkscreen color | White, yellow, black, blue | ||
| Solder Mask Capability | Min. solder mask opening | 0.05mm(2mil) | |
| Max. plugged via size | 0.65mm(25.6mil) | ||
| Min. width for line coverage by S/M | 0.05mm(2mil) | ||
| Min. solder mask legends width | 0.2mm(8mil) standard, 0.17mm(7mil) advanced | ||
| Min. solder mask thickness | 10um(0.4mil) | ||
| Solder mask thickness for via tenting | 10um(0.4mil) | ||
| Min. carbon oil line width/spacing | 0.25/0.35mm(10/14mil) | ||
| Min. tracer of carbon | 0.06mm(2.5mil) | ||
| Min. carbon oil line trace | 0.3mm(12mil)) | ||
| Min. spacing from carbon pattern to pads | 0.25mm(10mil) | ||
| Min. width for peelable mask cover line/pad | 0.15mm(6mil) | ||
| Min. solder mask bridge width | 0.1mm(4mil)) | ||
| Solder mask Hardness | 6H | ||
| Peelable Mask Capability | Min. spacing from peelable mask pattern to pad | 0.3mm(12mil)) | |
| Max. size for peelable mask tent hole(By screen printing) | 2mm(7.8mil) | ||
| Max. size for peelable mask tent hole(By aluminum printing) | 4.5mm | ||
| Peelable mask thickness | 0.2 ~ 0.5mm(8 ~20mil) | ||
| Silkscreen Capability | Min. silkscreen line width | 0.11mm(4.5mil) | |
| Min. silkscreen line height | 0.58mm(23mil) | ||
| Min. spacing from legend to pad | 0.17mm(7mil) | ||
| Surface Finish | Surface Finish Capability | Max. gold finger length | 50mm(2") |
| ENIG | 3 ~ 5um(0.11 ~ 197mil) nickel, 0.025 ~ 0.1um(0.001 ~ 0.004mil) gold | ||
| gold finger | 3 ~ 5um(0.11 ~ 197mil) nickel, 0.25 ~ 1.5um(0.01 ~ 0.059mil) gold | ||
| HASL | 0.4um(0.016mil) Sn/Pb | ||
| HASL Machine | Material thickness: 0.6 ~ 4.0mm(23.6 ~ 157mil) | ||
| Material size: 127 x 127mm ~ 508 x 635mm(5 x 5" ~ 20 x 25") | |||
| Hard gold plating | 1-5u" | ||
| Immersion Tin | 0.8 ~ 1.5um(0.03 ~ 0.059mil) Tin | ||
| Immersion Silver | 0.1 ~ 0.3um(0.004 ~ 0.012mil) Ag | ||
| OSP | 0.2 ~ 0.5um(0.008 ~ 0.02mil) | ||
| E-Test | Machine Capability | Flying probe tester | Material thickness: 0.4 ~ 6.0mm(15.7 ~ 236mil) |
| Material size: max. 498 x 597mm(19.6 ~ 23.5") | |||
| Min. spacing from test pad to board edge | 0.5mm(20mil) | ||
| Min. conductive resistance | 5Ω | ||
| Max. insulation resistance | 250mΩ | ||
| Max. test voltage | 500V | ||
| Min. test pad size | 0.15mm(6mil)) | ||
| Min. test pad to pad spacing | 0.25mm(10mil) | ||
| Max. test current | 200mA | ||
| Profiling | Machine Capability | Profiling type | NC routing, V-cut, slot tabs, stamp hole |
| NC routing machine | Material thickness: 0.05 ~ 7.0mm(2 ~ 276mil) | ||
| Material size: max. 546 x 648mm(21.5 x 25.5") | |||
| V-cut machine | Material thickness: 0.6 ~ 3.0mm(23.6 ~ 118mil) | ||
| Max material width for V-cut: 457mm(18") | |||
| Process Capability | Min. routing bit size | 0.6mm(23.6mil) | |
| Min. outline tolerance | +/-0.1mm(+/-4mil) | ||
| V-cut angle type | 20°, 30°, 45°, 60° | ||
| V-cut angle tolerance | +/-5° | ||
| V-cut registration tolerance | +/-0.1mm(+/-4mil ) | ||
| Min. gold finger spacing | +/-0.15mm(+/-6mil) | ||
| Bevelling angle tolerance | +/-5° | ||
| Bevelling remain thickness tolerance | +/-0.127mm(+/-5mil) | ||
| Min. inner radius | 0.4mm(15.7mil) | ||
| Min. spacing from conductive to outline | 0.2mm(8mil) | ||
| Countersink/Counterbore depth tolerance | +/-0.1mm(+/-4mil) | ||